Review: conducteo 5.0.2-1
Package Information
| Description | thermal bridge simulation software (EN 10211) Conducteo is a software package for numerical simulation of linear thermal bridges according to EN 10211. It provides detailed thermal analysis of building components, including heat flow calculations, temperature fields, thermal bridge coefficients (ψ-values), U-values, and equivalent thermal conductivity. Features include: - 2D steady-state thermal simulation - Computation of heat flows, ψ-values, U-values, and equivalent thermal conductivity - Support for thermal bridges involving multiple thermal environments - Condensation risk analysis using the Glaser method - Imports THERM models - Imports DXF geometry - Exports calculation reports (PDF and DOCX) The documentation and materials database are currently mainly available in French, which may limit usability for non-French-speaking users. |
|---|---|
| Maintainer | C. Marcel <clement.marcel@nwanda.fr> |
| Changed By | C. Marcel <clement.marcel@nwanda.fr> |
| Sponsor | wookey@debian.org |
| Distribution | unstable |
| Architecture | any |
| Closes | #1135142 |
| Tracker | https://tracker.debian.org/pkg/conducteo |
| Uploaded | 2 hours ago |
New Package Report
.changes
| Distribution | unstable |
|---|---|
| Date | Mon, 18 May 2026 11:00:00 +0200 |
| Source | conducteo |
| Version | 5.0.2-1 |
| Changed-By | C. Marcel |
| Architecture | source amd64 |
Changelog
conducteo (5.0.2-1) unstable; urgency=medium
.
* Initial release. (Closes: #1135142)
Minor English translation update for mouseover consistency
Upstream changes from 5.0.1:
- Replaced Boost dependency with internal implementation.
- Removed embedded Eigen source code.
- Removed embedded dxflib source code.
- Use English as default language on Linux.
- Move documentation to /usr/share/doc/conducteo/.
- Change icon set to MIT-licensed open-source icons.
- Add translation system for software interface and
materials database.
- Fix quickstart guide opening.
- Move examples to /usr/share/doc/conducteo/examples.
* Remove Windows-specific files from Debian source tarball..dsc
| Section | science |
|---|---|
| Priority | optional |
| Component | main |
| Package-List | conducteo deb science optional arch=any |
debian/copyright
Format: https://www.debian.org/doc/packaging-manuals/copyright-format/1.0/ Upstream-Name: conducteo Source: https://sourceforge.net/projects/conducteo Files: * Copyright: 2009-2026, Clément Marcel <clement.marcel@nwanda.fr> License: GPL-3+ Files: resources/icons/* Copyright: Tabler Icons contributors License: MIT Comment: Some icons are modified versions derived from the Tabler Icons project. Files: resources/icon.* resources/logo.png Copyright: 2009-2026, Manoël Verdiel License: conducteo-logo Files: install/data/rt2012.db Copyright: 2009-2026, Clément Marcel <clement.marcel@nwanda.fr> License: GPL-3+ Comment: Material properties database containing thermal conductivity and water vapour diffusion resistance values derived from publicly available building regulations and standards. License: GPL-3+ This program is free software: you can redistribute it and/or modify it under the terms of the GNU General Public License as published by the Free Software Foundation, either version 3 of the License, or (at your option) any later version. . This program is distributed in the hope that it will be useful, but WITHOUT ANY WARRANTY; without even the implied warranty of MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. . On Debian systems, the full text of the GNU General Public License version 3 can be found in /usr/share/common-licenses/GPL-3. License: conducteo-logo Redistribution and use as part of the Conducteo project are permitted by the copyright holder. License: MIT Permission is hereby granted, free of charge, to any person obtaining a copy of this software and associated documentation files (the "Software"), to deal in the Software without restriction, including without limitation the rights to use, copy, modify, merge, publish, distribute, sublicense, and/or sell copies of the Software, and to permit persons to whom the Software is furnished to do so, subject to the following conditions: . The above copyright notice and this permission notice shall be included in all copies or substantial portions of the Software. . THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT. IN NO EVENT SHALL THE AUTHORS OR COPYRIGHT HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER LIABILITY, WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING FROM, OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR OTHER DEALINGS IN THE SOFTWARE.
Review Information
started — allocated to awm 0 hours ago, started 0 hours ago.